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Tech Shorts: A Compilation of the Latest SoCs, Development Boards, and More
SoC,development boards,ai,microchip,dsp,Toshiba,qorvo,broadcom,littelfuse,Matter,Schottky barrier diodes,Nuvoton,Tech Shorts,voltage-controlled SAW oscillators,SMD fuse
Connectivity in Machine Vision Systems: A Comprehensive Analysis
Machine vision systems utilize a variety of camera formats and interfaces to capture and transmit image data.
Nexperia Launches Automotive-Qualified Single and Dual Small Signal MOSFETs
Superior Thermal Performance: DFN packages offer significantly lower thermal resistance compared to traditional leaded packages, improving device efficiency and reliability.
Industry 5.0: Humans and Machines Working Together for a Sustainable Future
Industry 5.0, automation, robots, human-centric, sustainability, edge computing, Samtec, distributor, industrial automation, Industry 4.0, artificial intelligence, machine learning
Ultra Micro PCB Connectors for Reliable 56 Gbps PAM4 Data Transfer
Samtec, Ultra Micro connectors, high-speed performance, automotive applications, Micro Blade & Beam connectors
The Critical Role of Connectors in Powering the AI Revolution
Scalability Through Interconnection
Spring Loaded Pogo Pins & Connectors: The Powerhouse of Reliable Connections
Pogo pins, contact pins, or spring-loaded connectors
AMD XRF4 RF Accessory Kit Showcases Samtec's Analog Over Array™ Technology
Technology Revolutionizes High-Density RF Interconnects
What Are High-Speed Link (HSL) Connectors?
High-speed data transfer,Data connectivity,Samtec,SiFly connector,Telemetry,Broadcasting,Fan engagement,Operational efficiency
The Indispensable D-Sub Connector: A Legacy of Reliability and Versatility
D-sub connectors are easily recognizable by their distinctive D-shaped metal shield.
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PCIe 7.0: A Timely Solution for High-Speed Interconnects
Samtec's recent demonstration showcased the feasibility of PCIe 7.0 technology with a 128 GT/s PAM4 interconnect system.
PCIe 7.0 Front Panel Interconnect Demo Shines at ECOC
PCIe 7.0, high-speed interconnect, data centers, AI, HPC, machine learning, Samtec
CISSOID's ICM Empowers Hydro Leduc's ePTO Solution
CISSOID, SiC Inverter Control Module, Hydro Leduc, ePTO, electric power take-off, truck electrification, power electronics
Renesas Expands R-Car ADAS Portfolio with New SoCs
Delivering up to 34 TOPS (tera operations per second) for demanding AI and ADAS applications.
Bourns Launches AEC-Q200 Compliant Transformer for High Voltage Battery Management Systems
Bourns, HVMA03F4A-LP8S, flyback transformer, automotive, high power density, low profile, isolation transformer, AEC-Q200, gate drive, battery management system
Custom Connectors: Tailored Solutions for Your Unique Needs
We work closely with manufacturers like Samtec to provide tailored solutions that exceed your expectations.
Samtec Drives Innovation in the Broadcast Industry
Samtec's Role in Enabling Broadcast Innovation
CISSOID Introduces Compact On-Board Inverter Reference Design for Accelerated EV Development
The EVK-PLA1060 offers a small footprint and high power density, making it ideal for space-constrained off-highway vehicles.
Samtec and BonChip Assist Engineers in Enhancing FPGA Performance with Advanced Interface Standards
High-speed data acquisition: Enabling the capture and processing of large volumes of data at high speeds.
Radiall's Miniature Connector Series Launched for the Defense Industry
Radiall, IMP connectors, high-frequency, low phase noise, solderless, compact, interconnect, aerospace, defense, telecommunications, industrial automation, medical devices
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The Future of 6G Communication: A Revolution in Connectivity
6G will provide seamless connectivity across devices, enabling new applications and services.
Nexperia Introduces AC-DC Flyback Controllers for Applications Requiring High Power Density
Nexperia, AC/DC flyback controller, GaN, power delivery, adapters, wall sockets, industrial power supplies
Bourns Introduces New Automotive-Grade Multilayered Varistors
Bourns, varistors, multilayered varistors, automotive grade, surge protection, transient energy absorption
Microchip Technology Launches Wi-Fi Solutions for Industrial and Commercial Use
Microchip, Wi-Fi, wireless connectivity, industrial applications, commercial applications
Richtek Launches 45W Buck-Boost Switching Battery Charger for POS Systems
Richtek, RT9492, battery charger, buck-boost, Li-ion, Li-polymer, 45W, high efficiency, dual input control
Toshiba Electronic Devices and Storage Corporation Launches MOSFETs for IoT Uses
Toshiba, MOSFET, low leakage current, energy efficient, portable electronics, IoT devices
Semikron Danfoss Utilizes BASF Polyphthalamide in IGBT Production
BASF, PPA material, Semitrans 10 IGBT, power electronics, high temperature resistance, electrical insulation
Delta Electronics to Supply 200 kW DC EV Chargers to McDonald's in France
Delta, UFC 200, ultra-fast charger, EV charging, IZIVIA, McDonald's, electric vehicle, battery charging
Micro Commercial Components Introduces 5000W TVS Diodes for Power Management
Micro Commercial Components, TVS diode, transient voltage suppression, ESD protection
Infineon Technologies Launches Fingerprint Sensor Chips for Automotive Authentication
Infineon Technologies, CYFP10020A00, CYFP10020S00, fingerprint sensor, automotive
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USB-C 240W Fast Charging: A Game-Changer for Power Delivery
USB-C 240W, fast charging, power delivery, USB PD, USB Type-C, EPR, charging technology
Lattice Merges Fixed Hardware Security with FPGA Flexibility
Lattice MachXO5D-NX: Secure and Powerful FPGAs for the Evolving Edge
XP Power Launches 550W AC-DC Power Supplies for Medical and Industrial Applications
Optimized for Medical, Industrial, and IoT Applications
Cinch Connectivity Solutions Launches Hybrid Transceiver for Military and Aerospace Use
Cinch Connectivity Solutions Unveils a Powerful and Adaptable Transceiver
SemiQ Introduces Known-Good-Die Program for Its Silicon Carbide MOSFET Lineup
SiC is a revolutionary material rapidly gaining traction due to its exceptional properties
Souriau by Eaton MIL-DTL-38999 Series III Space Grade: The Ultimate Connector for Harsh Environments
MIL-DTL-38999 Series III Space Grade, circular connector, space applications, harsh environments, quick mating, robust scoop proof, extended performances, broad range
Qualcomm Unveils the Snapdragon 7+ Gen 3: Powering Tomorrow's Mid-Range Mobile Devices
Qualcomm Snapdragon 7+ Gen 3, mobile processor, CPU performance, GPU performance, on-device AI, generative AI, Wi-Fi 7, HBS multi-link, Snapdragon 8 series, Snapdragon 7 series
STMicroelectronics Launches 100V Trench Schottky Rectifier Diodes Tailored for Power Conversion Applications
The new family of trench Schottky diodes encompasses 28 variants, catering to a wide range of design requirements.
TDK Launches AC-DC Power Supply Solutions for Automation in Industrial Settings
The ZWS-C series delivers rated power outputs of 10W, 15W, 30W, and 50W, making them suitable for various industrial applications.
Intel Achieves ‘World’s Fastest Desktop CPU’ Milestone with 6.2 GHz Speed Achievement
intel,cpu,computing,desktop processors,Intel Core i9-14900KS